In addition to the general demand of adhesive dispensing, hot melt application mainly provides the Electronic industry as a manufacturing solution encompassed overmolding, heat insulation, shock-proof and isolation. And the friendly thermoplastic polyamides extremely meet to fulfill those needs.
HES product HS6200-U, the Low-Pressure Electronic Package Machine is designed to commit to such special application, use PUR with dual workstations greatly enhanced production efficiency and fluency work.


Hot Melt Applicator-HS6200-U

HS6200-U electronics application